Picosecond laser Cutting and Splitting Machine

The Picosecond Laser Cutting and Singulation Machine is designed for high-precision glass cutting and singulation processing. It features high cutting accuracy, high yield rate, high efficiency, and simultaneous movement of dual platforms. One platform is used for picosecond processing, while the other is dedicated to CO₂ laser singulation, achieving double the efficiency. It offers significant advantages especially for the cutting of special-shaped glass.